QC72-3220-1101-I2
- Manufacturer :
 - SECO
 
- Product Category :
 - Computer-On-Modules - COM
 
- Dimensions :
 - 70 mm x 40 mm
 
- Form Factor :
 - 70 mm x 40 mm
 
- Frequency :
 - 1.8 GHz
 
- Installed RAM :
 - 2 GB
 
- Interface Type :
 - CAN, Ethernet, QSPI, SPI, UART, USB
 
- Maximum Operating Temperature :
 - + 85 C
 
- Minimum Operating Temperature :
 - - 30 C
 
- Operating Supply Voltage :
 - 5 VDC
 
- Processor Brand :
 - NXP
 
- Processor Type :
 - i.MX 8M Mini
 
Manufacturer related products
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                                            SECOModules Accessories Q7 - CQ7-A42 - Carrier Board for Qseven rel. 2.0 Compliant modules on 3.5" Form factor - DisplayPort - 2nd Ethernet Port - LVDS - Debug Port
 
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                                            congatecComputer-On-Modules - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB Intel Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-U).
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                                            congatecComputer-On-Modules - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD
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                                            congatecComputer-On-Modules - COM Qseven module with Intel Celeron N3060 dual core processor with 1.60GHz core frequency up to 2.48GHz burst, 2MB L2 cache, 2GB 1600MT/s DDR3L onboard memory and 16GB eMMC onboard flash.
 
Related products
| Part | Manufacturer | Stock | Description | 
|---|---|---|---|
| QC72-1140-1111-C2 | SECO | 10 | Computer-On-Modules - COM Q7-C72 w/NXP i.MX8M Mini Quad, 4GB DDR4 (2x16Gb), 32GB eMMC, LVDS, CAN, WiFi/BLE, QSPI, Comm.Temp | 
| QC72-DISS-1-PK | SECO | 10 | Heat Sinks uQ7 - uQ7-C72-J Mini/Nano Heat spreader (PASSIVE) Packaged | 
| QC72-DISS-2-PK | SECO | 10 | Heat Sinks uQ7 - uQ7-C72-J Mini/Nano Heat Sink (PASSIVE) Packaged | 
 