- Manufacturer :
- Chip Quik
- Product Category :
- Solder
- Alloy :
- Sn96.5/Ag3.0/Cu0.5
- Contains Lead :
- NO
- Description/Function :
- Synthetic No-Clean
- Package Type :
- Syringe
- Product :
- Solder
- Size :
- 10 cc
- Type :
- Paste, No Clean
- 数据表
- TS991SNL35T3
Manufacturer related products
-
-
Chip QuikThermal Interface Products Heat Sink Thermal Compound - Deep-Space Liquid Metal 79 W/mK 1g/1cc Syringe -
Chip QuikThermal Interface Products Heat Sink Thermal Compound - Deep-Space Liquid Metal 79 W/mK 5g/1cc Syringe
-
Chip QuikThermal Interface Products Heat Sink Thermal Compound - Deep-Space Liquid Metal 79 W/mK 10g/3cc Syringe
-
Chip QuikThermal Interface Products Heat Sink Thermal Compound - Deep-Space Liquid Metal 79 W/mK 20g/3cc Syringe
Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| TS991AX35T4 | Chip Quik | 10 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (35g syringe) |
| TS991AX500T4 | Chip Quik | 0 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar) |
| TS991SNL35T4 | Chip Quik | 10 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe) |
| TS991SNL500T3 | Chip Quik | 0 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar) |
| TS991SNL500T4 | Chip Quik | 0 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar) |
