341700F00000G
- Mfr.Part #
 - 341700F00000G
 
- Manufacturer
 - Aavid, Thermal Division of Boyd Corporation
 
- Package/Case
 - -
 
- Datasheet
 - Download
 
- Description
 - Heat Sinks Thin-Fin, Board Level Heat Sink for PCI/AGP Chip Sets, Thin Fin, Horizontal Mounting, Copper, 12.7x76.2x0.33mm
 
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- Manufacturer :
 - Aavid, Thermal Division of Boyd Corporation
 
- Product Category :
 - Heat Sinks
 
- Designed for :
 - BGA, PGA, QFP
 
- Heatsink Material :
 - Copper
 
- Height :
 - 0.33 mm
 
- Length :
 - 76.2 mm
 
- Mounting Style :
 - Adhesive
 
- Product :
 - Heat Sinks
 
- Width :
 - 12.7 mm
 
- 数据表
 - 341700F00000G
 
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 - 
                                            Aavid, Thermal Division of Boyd CorporationHeat Sinks Heat Pipe, Round, Sintered Wick, 8mm Diameter, 100mm Length, 0.3mm Wall Thickness, 0.8mm Wick Thickness
 - 
                                            Aavid, Thermal Division of Boyd CorporationHeat Sinks Heat Pipe, Round, Sintered Wick, 5mm Diameter, 97mm Length, 0.3mm Wall Thickness, 0.7mm Wick Thickness
 - 
                                            Aavid, Thermal Division of Boyd CorporationHeat Sinks Heat Pipe, Round, Sintered Wick, 6mm Diameter, 150mm Length, 0.3mm Wall Thickness, 0.8mm Wick Thickness
 
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